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    DDR

    内嵌自检测修复(ECC)DRAM芯片系列产品是西安星欧平台推出的商用的内嵌ECC技术DRAM芯片产品,具有高可靠、大容量、高位宽、高宽温、多接口等特点,与传统JEDEC标准DRAM芯片“即插即用”式兼容。 针对质量有更高要求的用户,西安星欧平台提供超稳健性XR ECC DRAM芯片系列产品。

    Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
    SCX25D512800AF

    512Mb

    64Mbx8

    2.5V

    TFBGA60

    10x12

    MP

    400/333

    C I A3 A2 A1

    IBIS

    SCX25D512160AF

    512Mb

    32Mbx16

    2.5V

    TFBGA60

    10x12

    MP

    400/333

    C I A3 A2 A1

    IBIS

    SCE25D1G800BE-

    1Gb

    128Mbx8

    2.5V

    TSOPⅡ66

    11.76x22.22

    MP

    400/333

    C I

    IBIS

    SCE25D1G800AF

    1Gb

    128Mbx8

    2.5V

    TFBGA60

    10x12

    MP

    400/333

    C I A3 A2 A1

    IBIS

    SCE25D1G160BE-

    1Gb

    64Mbx16

    2.5V

    TSOPⅡ66

    11.76x22.22

    MP

    400/333

    C I

    IBIS

    SCE25D1G160AF

    1Gb

    64Mbx16

    2.5V

    TFBGA60

    10x12

    MP

    400/333

    C I A3 A2 A1

    IBIS

    Notes

    • Temperature Specification:

      C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)

      I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)

      A1 = Automotive grade 1(-40°C ~ +125°C)

      A2 = Automotive grade 2(-40°C ~ +105°C)

      A25 = Automotive grade 2(-40°C ~ +115°C)

      A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)

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